• Home
  • Infrastructure

Infrastructure

Infrastructure
Infrastructure
Infrastructure
Infrastructure
Infrastructure
Infrastructure

  • Metal AM Infrastructure

    • Laser sources: Disk Laser Trumpf TruDisk 16002 (16 kW), Diode Laser LASERLINE LDF 6000-40 (6kW), CO2 Laser Rofin DC035 (3,5kW), Fiber Laser ROFIN FL15C (1,5 KW), Fiber Laser ROFIN FL080 (8kW), COHERENT ARM fiber laser 8kW, Diode Laser LASERLINE LDM 4000-40 (4kW).
    • Laser Heads: Wire heads (lateral and coaxial (Coaxprinter from PRECITEC), powder nozzles (anular coaxial, 3 jet and 6 jet).
    • Wire Arc Additive Manufacturing: Fronius sources for GMAW, GTAW, Plasma.
    • Material feeding equipment: Wire feeding systems: Fronius TSP5000/4000, DINSE wire feeding system for Laser applications; Powder feeding systems: Powder feeder Medicoat, Powder feeder GTV , powder feeder BLC.
    • Positioning systems: Robotized LMD (ABB: IRB 140, IRB 1400, IRB 4400 and IRB 6600), CNC LMD: 5 axis CNC machine, REIS 9 axis gantry with work range of 5m * 2m * 1m. Inert envelope for the processing of highly reactive materials.
    • Software: RobotStudio, RoboDK, Labview, Matlab, SolidWorks, Power mill, ABAQUS, SIMUFACT.
    • Quality and process control: Pirometer for the real time control of the power; Beam measurement system SPIRICON LBS-300 and Mode Check; Beam characteristics measuring equipment PRIMES FM120; CLAMIR for LMD process control, 3D Scanner CREAFORM Handyscan black, high-speed camera.

  • Composite AM Infrastructure

    • AFP (Automated Fiber Placement): Flexible AFP heading for thermoset, thermoplastic and dry fibre processing (tow width 6-25mm), laser-based (6kW) and IR heating systems, fully robotised system (FANUC, ABB), robotised cell for 2x1m components fabrication.
    • Fused Filament Fabrication (FFF): Materials development,Continuous Fiber Filament and Pellets, Desktop printers (up to A2 and 450ºC), FFF robotized pilot cell (Continuous CF 3D printing), FFF large format robotized cell (dimensions: 7m x 4m), Two position tables, pellets and filament heads, LASER heating integration, controlled T and H room.
    • Laser control, process monitoring, quality control: Laser Dual-wavelength Laser Source AD2T01; Optical Power Meter AD2A04; Chemical laboratory to made metallic coating of the fibre; Machine for metallic coating of optical fibre; Sputtering coating machine for coating FBG sensors; Tubular oven up to 1300oC to calibrate the thermal response of the FBG sensors; ND-DC Dip coater from Nadatech.

  • Digital-related Infrastructure

    • Fiber Optic Sensor monitoring: Six interrogators for Fiber Bragg Grating (FBG) sensors (form 1 to 8 chanels, from 1 to 19kHz of acquisition frequency); One Brillouin distributed interrogator, Optical Spectrum Analyzer AQ6370D from Yokogawa, Tunable laser OSICS Multifunction Platform 8-Channel Modular Platform from Yenista optics, EDFA100S and EDFA100P Erbium, Doped Fiber Amplifiers, 2 fiber optic splicers, Laser Dual-wavelength Laser Source AD2T01, Optical Power Meter AD2A04, Equipment for fiber metallic coating (lab&pilot), Tubular oven up to 1300oC to calibrate the thermal response of the FBG sensors.
    • Thermal cameras: Flir SC7600-MB; Xenics Gobi-640-GigE; IR modular prototype camera with several adquisition ranges: NIR, SWIR MWIR y LWIR; High speed cameras: Photron mini AX 200.
    • Laboratory for edge computing including some of the most advanced GPU SoCs (nVidia Jetson TX1, TX2 and Xavier), FPGA SoC (Xilinx Zynq-7000 boards) and TPU SoCs (Coral Dev Board and Accelerator).
    • High Performance Computing infrastructure: Multiple GPU servers (CPU: 16 cores; Memory: 768 GB GPU 2xRTX 8000 48GB; CPU: 16 cores; Memory: 64 GB GPU 2x RTX20XX 8GB; CPU: 16 cores; Memory: 64 GB GPU 2x RTX20XX 8GB; CPU: 8 cores; Memory: 64 GB GPU 2x RTX20XX 8GB) and a cluster for the development of AI and distributed computing solutions (2 Dell servers PowerEdge 740, storage systems DellEMC -80TB-, 2 backup systems DellEMCde -32 & 80TB- and data analytics software: VMWare vSphere Essentials Plus).

  • Testing Laboratories

    • Materials and components testing laboratories: Metalographic microscopes (OLYMPUS GX-71 y LEICA MEF4A), Confocal Optical Microscope (OM) and Scanning Electron Microscope (SEM, FE- SEM+EDS+EBSD), mechanical testing equipment (Universal testing 5, 250, 600 & 1000 kN Machines -tensile, compression, bending, fatigue-, multiaxial testing frame -250 kN-, charpy and Izod impact testing, creep and dynamic testing, electromechanical 250 Hz fatigue testing), DMA (TA instruments Q800), TGA (TA instruments Q500), DSC (TA instruments Q20), FT-IR Jasco 6200 spectrometer, NDT equipment (Ultrasound, Magnetic, Eddy Current and Radiographic Testing Equipment, Computerized Axial Tomography Equipment, Real Time Digital Radiography, Fluoroscopy System, Magnetic Leak testing system, Equipment for NDT automation), contact angle, surface tension measurement, profilometer.